Magic Unicorn Thinlet die
Sizzix thinlets dieThese wafer-thin chemically-etched die sets are designed to cut, emboss or stencil a single sheet of cardstock, paper, metallic foil or vellum and felt. To cut, the sandwich requires use of a pair of Cutting Pads and the machine's included Platform; when using the Essentials Platform or Solo Platform & Shim, the Extended Adapter or Solo Adapter is required. Because of their intricacy, Thinlits dies may require up to three passes to cut. If extra ejection is needed for easier separation of the die-cut from the design, place wax paper between the Thinlits die and your material and then cut.
This die is designed for use only with the BIGkick, all Big Shot machines and Vagabond machines and requires the use of a pair of standard Cutting Pads.
0.64cm x 0.64cm - 4.45cm x 8.89cm